IEEE Chips Summit
Dresden 2025
May 14–15, 2025 in Dresden, Germany

Join us for the first IEEE Chips Summit Dresden 2025 on May 14-15 at Messe Dresden, where industry leaders, academic pioneers, and tech enthusiasts will converge for a dynamic two-day event. Organized by IEEE, 5G Lab Germany, TU Dresden and Barkhausen Institut, this summit promises insightful talks from global professionals and innovative demonstrations from a diverse array of startups and academic institutions. Attendees will have the chance to engage in discussions about groundbreaking ideas, explore emerging trends, and discover new business opportunities that will shape the future of modern chips.​

Startup Call

We are thrilled to announce our startup call for this impactful industry-focused event. We invite startups to apply for the opportunity to pitch their company and products in one of our keynote sessions and get a presentation area in our exhibition.

Interested in showcasing your startup at our event? Download our Startup Call for more information.

Be part of this influential conference, where innovation meets expertise, and witness the evolution of the next generation of chips.

Presented by

IEEEIEEE Communications Society5G Lab GermanyTU DresdenBarkhausen Institut

Part of

DCCF

Venue

Location: Messe Dresden

Accommodation: Book a Hotel

Feel free to use our booking links for the Maritim Hotel in German or English.

Partners

Interested in becoming a patron? Check our Patronage Brochure.

To arrange your individual patronage package, please contact Nicole Flechs.

Speakers

To be announced.

Registration

Registration is now available. Please register >> here << .

Please note: The registration portal is for the IEEE 6G Summit Dresden and the IEEE Chips Summit.
The purchase of a participation ticket authorizes access to both events.

Prices

Standard
Late
Last Minute / On-Site
Regular *
575 €
625 €
675 €
IEEE Member *
525 €
575 €
625 €
Student *
300 €
325 €
350 €
Networking Only **
125 €
150 €
175 €

Prices excluding 19% VAT that apply additionallyincluding 19% VAT.

* Includes participation in the conference at Messe Dresden on May 14 + 15, coffee break and lunch catering, and participation in the conference dinner on May 14.

** Includes participation in the conference dinner on May 14.

Registration Deadlines

Standard April 15, 2025 (23:30 CEST)
Late May 6, 2025 (23:30 CEST)
Last Minute/ On-Site May 15, 2025

Agenda

The first Chips Summit is part of the Dresden Chips & Communications Festival 2025 (DCCF). The DCCF and its many sub-events form days full of versatile scientific dialogue, exciting talks, and show innovations on chip design and applications. In addition to Chips Summit Dresden with presentations from leaders in academia and industry on May 14, the DCCF will also feature the high impact IEEE 6G Summit Dresden on May 15 with which it will share a two-day exhibition showcasing the potential of 5G and 6G technology.

Agenda

Exhibition

Committee

General
Chair
Prof. Dr. Gerhard P. Fettweis
Prof. Dr. Gerhard P. Fettweis
TU Dresden /
Barkhausen Institut
General
Chair
Dr. Wahab Almuhtadi
Dr. Wahab Almuhtadi
IEEE ComSoc
General
Vice-Chair
Prof. Dr. Holger Blume
Prof. Dr. Holger Blume
Leibniz University Hannover
General
Vice-Chair
Jens Drews
Jens Drews
GlobalFoundries
General
Vice-Chair
Prof. Dr. Jan M. Rabaey
Prof. Dr. Jan M. Rabaey
University of California at Berkeley
General
Vice-Chair
Dr. Gerd Teepe
Dr. Gerd Teepe
Celtro GmbH
Finance
Chair
Dr. Rico Radeke
Dr. Rico Radeke
TU Dresden
Program
Co-Chair
Dr. Tianxiang Dai
Dr. Tianxiang Dai
Lancaster University Leipzig
Program
Co-Chair
Dr. Michael Raitza
Dr. Michael Raitza
Barkhausen Institut
Industry Relations
Chair
Nicole Flechs
Nicole Flechs
TU Dresden
Local Arrangements
Co-Chair
Berenike Heinrich-Männchen
Berenike Heinrich-Männchen
TU Dresden
Local Arrangements
Co-Chair
Claudia Hoffsky
Claudia Hoffsky
TU Dresden

Terms and Conditions